Samsung slims down NAND memory packaging, wafer-thin gadgets to follow

Published by Tech Pundit | Filed under Gadgets & Tech, Storage | November 6th, 2009

Good old Samsung and its obsession with thinness. After finally letting its 30nm 32Gb NAND chips out of the bag in May, the Korean memory maker has now successfully halved the thickness of its octa-die memory package to a shockingly thin 0.6mm (or 0.02 inches). The new stacks will start out at a 32GB size, though the real benefits are likelier to be felt down the line when the ability to pack bits more densely pays off in even higher storage capacities

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Samsung slims down NAND memory packaging, wafer-thin gadgets to follow